43 lines
1.3 KiB
Markdown
43 lines
1.3 KiB
Markdown
# AC701N Earphone SDK
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## 基本信息
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- 工程名称:AC701N Earphone SDK
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- 版本号:V1.0.1
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- 生成时间:2026-08-19 15:43:10
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- 适用芯片:AC7016C(BR28)
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## 目录说明
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```
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JBao_JL7016_SOC_SDK_V1.0.1/
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├── apps/
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│ ├── common/ # SDK 公共模块
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│ ├── earphone/ # 耳机应用
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│ ├── usr_jb_proto/ # 应用协议层
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│ ├── usr_periph/ # 板级外设(RTC 等,源码开放)
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│ └── usr_le_code/ # BLE 协议层(源码直编:协议编解码 + 广播/收发 + mjson)
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├── cpu/ # 芯片相关代码与工具
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├── include_lib/ # SDK 头文件
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├── tools/ # 工程工具
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├── Makefile
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├── AC701N.cbp
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└── JBao_JL7016_SOC_SDK_README.md
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```
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### 封装模块公开接口
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**apps/usr_le_code**
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- 源码直编(已弃用预编译静态库 `libusr_le_code.a`),源文件随主工程一起编译:
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- `apps/usr_le_code/ble_proto.c` / `bleproto.c` / `bleproto_packer.c`
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- `apps/usr_le_code/usr_le_adv.c` / `usr_le_recieve.c`
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- `apps/usr_le_code/thirdpart/mjson/mjson.c`
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- 公开头文件:
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- `apps/usr_le_code/usr_le_api.h`
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- `apps/usr_le_code/usr_le_product.h`
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---
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*本文件由 tools/package_release.py 自动生成。*
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